| System |
Applications |
| L-12 / K-10 / K-86 |
Low viscosity hot curing solvent free system. Used for G-11 laminates |
| L- 12 / K- 5 |
General purpose laminating system with good electrical and mechanical properties with high HDT |
L-12 / K-24
|
Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions |
| L-12 / K-5 or L-12 / K-68 / K270 |
Laminating systems for pultrusion |
L-12 / XH-65
|
Offers easy mixing & longer potlife at room temperature. Used in laminates, smaller castings & pultrusions |
L-238 / K-86
|
For Mica Tapes manufacturing |
| L-552 / K-552 |
Low viscosity, solvent free epoxy laminating system for glass, aramid, carbon fiber by hand lay-up resin transfer moulding, press moulding and filament winding systems. Good mechanical strength both static and dynamic. |
| L-43 / K-6 |
Laminating system for Boat building applications |
L-135 / -> K-233
K-235
K-237
K-238
|
Laminates offer excellent dynamic mechanical properties. Suitable for hand lay-up match die moulding vacuum, bag mold etc. can be used for sport goods, auto components, gliders, windmill blades etc |