Type of system : Unfilled | Nature : Hot cure / Indoor | Mixing ratio (Parts by weight) : 100 : 100 : 0.0 – 0.2 | Glass transition temperature (Tg) (^oC) : 90 – 100 | Thermal class : F | Applications : Dry Distribution Transformers, Electronic assembly, Rotating machines

Recommendations: A low viscosity hot curing epoxy system for impregnation and encapsulation applications.