Type of system : Unfilled | Nature : Cold cure / Indoor | Mixing ratio (Parts by weight) : 100 : 10 | Glass transition temperature (Tg) (^oC) : 60 – 70 | Thermal class : B | Applications : Adhesives, Electronic assembly

Recommendations: An ambient curing epoxy system for encapsulation of low voltage applications. Unfilled system works as adhesive for bonding application.